In this session Ansys R&D members will give an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel, including how Ansys simulation tools and workflows fit into those frameworks.
Topics covered:
- Advanced 3DIC packaging trends and challenges faced by engineers
- 3DIC system data flows from P&R to analysis tools
- EMIR and Thermal Integrity flows using RedHawk SCTM and RedHawk SC ElectroThermalTM
