Advanced Thermal Management Simulation for Electronics
Innovative simulation software designed for electronics thermal management, leveraging computational fluid dynamics (CFD) to model heat transfer in electronic systems. It allows engineers to analyze temperature distributions, airflow, and heat dissipation in devices ranging from individual components to entire systems. By integrating with other Ansys tools, Icepak supports multi-physics simulations, enhancing accuracy and efficiency in design optimization. Its capabilities extend to solving complex cooling challenges in sectors like aerospace, automotive, and consumer electronics, ensuring reliability and performance. Icepak also offers a user-friendly interface and automated meshing capabilities, streamlining the setup and execution of simulations.
- Unstructured, Body-fitted Meshing
- High-fidelity CFD Solver
- Electro-thermal and Thermo-Mechanical silumations
- Thermal Reliability Solution
- Extensive Libraries for Thermal analysis
- Multi-Physics Integration
- MCAD and ECAD Support
- Electronic Components Libraries
Check out the key features of Ansys Icepak
Flexible Automatic Meshing
The simulation process is streamlined by automatically generating meshes tailored to the geometry of electronic components. This feature optimizes mesh quality and density, reduces setup time, and ensures accurate thermal and airflow analysis for complex designs.
Icepak Objects
Model creation is simplified by providing pre-defined objects that represent common electronic components such as chips, heat sinks, and fans. These objects come with built-in thermal and flow properties, enabling rapid setup and accurate simulations, ultimately enhancing design efficiency and accuracy.
Network Modeling
Simulating fluid flow and heat transfer in complex networks of pipes, channels, and ducts allows for detailed analysis of fluid behavior, pressure drops, and thermal characteristics. This analysis is crucial for designing efficient cooling and heating systems in diverse applications, such as automotive, HVAC, and industrial equipment.
DC Joule Heating Analysis
This feature enables engineers to simulate and analyze the heating effects caused by direct current (DC) electrical currents in electronic components. It provides insights into temperature distributions and thermal management strategies, crucial for optimizing the design and reliability of electronic devices experiencing DC power dissipation.
Dynamic Thermal Management
Real-time adjustment of cooling strategies, based on varying operational conditions and heat loads, is used to optimize thermal performance. This involves dynamically controlling fans, heat sinks, and other cooling mechanisms to ensure efficient temperature regulation.
Parametrics and Optimization
By exploring design variations and parameters systematically, you can use Ansys software to run automated simulations across multiple scenarios, enabling efficient parametric analysis and optimization. This process helps engineers identify the best design choices quickly and accurately.
Liquid Cooling
Ansys Icepack enables detailed simulation of coolant flow and heat transfer in liquid-cooled electronic systems. It models fluid behavior in channels, heat exchangers, and components, optimizing thermal performance and system reliability for complex designs.
Solar radiation
You can simulate the impact of solar heat flux on electronic devices and systems, modeling how solar radiation interacts with surfaces and influencing temperature distributions and thermal management strategies. This capability is essential for designing outdoor electronics and solar panels.
Varying Flow and Power ROM
This feature allows for reduced-order modeling (ROM) of thermal systems with variable flow rates and power inputs. It enables quick simulations across different operating conditions, facilitating efficient design exploration and optimization of electronic cooling solutions.
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Software Sales
If you have any general questions about our Ansys, Moldex3D, Dante, Particleworks, or CF Turbo simulation software (quotation, licensing, training), please contact us using one of the following contact details. Please note that our software is only available to customers from the following countries: Hungary, Slovenia, Croatia, Serbia, Bosnia and Herzegovina, Montenegro, and Macedonia.
sales (at) econengineering.com
+36 1 279 0320
Greg Lipóczi, Dr.
Commercial Director
László Molnár, Ph.D.
Academic & Key Account Representative
Péter Bara
Key Account Manager
East Hungary
János Simon
Key Account Manager
West Hungary
